Key Capabilities

Imaging
The UC+ Immersion mode and TLD are capable of sub-nanometer SEM resolution on non-magnetic semiconductor devices. The field-free mode is safe on magnetic materials and also provides for high-resolution imaging on multiple channels.
Patterning
Ion patterning with native shapes including circles, rings, lines, and polygons, or import of 24-bit BMP files. Allows fast prototyping and device modification. Combined with the enhanced carbon etch, milling tools can precisely modify PMMA masks and polyimide films. Site-specific tungsten and carbon deposition enhance circuit editing capabilities.
Cross-Section Analysis
Serial sectioning and analysis using Auto Slice & View, Oxford elemental analysis (EDS), and volume rendering with Avizo gives researchers access to large amounts of subsurface data. The Clean Connect air-free sample transfer shuttle prevents degradation of batteries and other air and moisture-sensitive materials.
TEM Sample Prep
The gallium ion source, EZ lift microprobe, site-specific carbon and tungsten deposition, combined with the ICE detector enable for ultra-thin TEM sample preparation and minimal damage.

Data Produced

TEM lamella and APT samples Secondary Electron, Back-scatter Electron, and sTEM micrographs Prototype semiconductor devices, device or pattern edits, nanosculpted structures Electron imaging and elemental analysis of rendered volumes

Compatible Samples

The system is suited for materials science, semiconductor analysis, and other applications requiring detailed structural and compositional insights at the nanometer scale. Samples must be compatible with a chamber vacuum of 10-6 mBar. Any residual solvents or residues on the sample that outgas at this pressure will interfere with imaging and can contaminate the instrument. Samples must have a resistance of less than 1010 Ohm or have a conductive coating.