The Fischione Dimple Grinder is an intermediate step in the preparation of hard (conventional) materials for TEM analysis. Dimple grinding follows planarization and polish and precedes ion-milling. This mechanical grinder thins only the central area of a TEM sample and leaves the outer edge thick enough to handle with tweezers. The area of interest can be precisely positioned at center using a 40X optical microscope.  Final thickness at the center of the sample is just a few micron and can be quickly ion polished to remove scratches. Capable of both 1-sided and double-sided dimple grinding with 1um resolution. Prethins TEM samples up to 200um thick in preparation for ion polishing.