Molecular Analysis Facilty Tool

FIB-SEM

Make/Model: Helios 5UX
Location: MolES G44O
The Helios 5UX DualBeam is a gallium ion and electron beam system capable of high-resolution imaging, nanofabrication, subsurface analysis, and TEM sample preparation.
Primary Detector Modes:
  • ETD (Everhart-Thornley Detector): field-free mode SE
  • TLD (Through-Lens Detector): field-free and immersion mode SE
  • MD (Mirror Detector): backscatter
  • ICD (In-Column Detector): backscatter with highest Z-contrast sensitivity
  • ICE (Ion Conversion & Electron): low-voltage, low-current imaging for lamella thinning
  • sTEM (scanning-Transmission): brightfield, darkfield, and high-angle annular darkfield (HAADF)
  • Instrument Details
  • Example Data

Key Capabilities

Imaging
The UC+ Immersion mode and TLD are capable of sub-nanometer SEM resolution on non-magnetic semiconductor devices. The field-free mode is safe on magnetic materials and also provides for high-resolution imaging on multiple channels.
Patterning
Ion patterning with native shapes including circles, rings, lines, and polygons, or import of 24-bit BMP files. Allows fast prototyping and device modification. Combined with the enhanced carbon etch, milling tools can precisely modify PMMA masks and polyimide films. Site-specific tungsten and carbon deposition enhance circuit editing capabilities.
Cross-Section Analysis
Serial sectioning and analysis using Auto Slice & View, Oxford elemental analysis (EDS), and volume rendering with Avizo gives researchers access to large amounts of subsurface data. The Clean Connect air-free sample transfer shuttle prevents degradation of batteries and other air and moisture-sensitive materials.
TEM Sample Prep
The gallium ion source, EZ lift microprobe, site-specific carbon and tungsten deposition, combined with the ICE detector enable for ultra-thin TEM sample preparation and minimal damage.

Data Produced

TEM lamella and APT samples Secondary Electron, Back-scatter Electron, and sTEM micrographs Prototype semiconductor devices, device or pattern edits, nanosculpted structures Electron imaging and elemental analysis of rendered volumes

Compatible Samples

The system is suited for materials science, semiconductor analysis, and other applications requiring detailed structural and compositional insights at the nanometer scale. Samples must be compatible with a chamber vacuum of 10-6 mBar. Any residual solvents or residues on the sample that outgas at this pressure will interfere with imaging and can contaminate the instrument. Samples must have a resistance of less than 1010 Ohm or have a conductive coating.
  • Sample holders are available for 4" wafers, petrographic thin sections, and metallurgical mounts.
  • The multi-purpose specimen holder accommodates up to four ½ ‘’ or two 1’’ specimen stubs, two ½’’ or one 1’’ stub in 45° pre-tilted position, and removable row holder for 6 TEM grids. It can interface with a variety of pin-mount stubs (3.2mm pin dia.)
  • Cross Holder can fit up to 5 pin-mounts ranging from 12.5mm to 32mm diameter.
  • UMB stub holder kit has 2 clamp bars and 2 stub modules that can each hold a 3.5" mount or two 1" mounts.
  • The Clean Connect sample shuttle can accommodate one 1" pin-mount and one mini-row bar. The maximum sample height as about 8mm. The clean connect stage adapter must be installed in the chamber.
The Helios 5 UX is equipped with a 5-axes motorized eucentric stage. It features piezo-driven X, Y, and Rotation for high-precision movement. Travel along the x and y-axis is 150 mm and the tilt range is -10 to 60 degrees. The motorized z-range is 10 mm but taller samples can be accommodated by manually adjusting the stage height. Minimum step size is 100 nm, repeatability at 0 and 52 degrees tilt is 1 μm.